PCB / First article and bring-up

Assembly · 16

First article and bring-up

Power, flash and the first UART. This is the landing step we sell — after the factory process, not instead of it.

01 What happens

  • Confirm rails, LED, crystal, and that the ESP32 enumerates or shows a boot log.
  • Flash the known-good image, then run ping, I2C scan or Wi-Fi station as the design requires.
  • Record a fault list: fab, SMT, or firmware. Mixing them in one ‘board bad’ note wastes the next spin.

02 On an ESP32 board

  • UART pins on ESP32 vary by module; the log is the first proof of life after 3.3 V.
  • Antenna keep-out mistakes show up as weak RSSI, not as a missing resistor on AOI.
  • A brown-out on Wi-Fi TX is often power design, not ‘bad ESP32 silicon’.

03 What usually fails

  • No 3.3 V because the DCDC footprint was mirrored — process looked fine.
  • Strapping pins floating so the chip is in download or wrong voltage.
  • Assuming FCC/CE is included because the module is certified. The product is not the module.

04 What we check

  • This is the bring-up package: rails, flash path, first UART, first bus, a short video.
  • The repeatable path is the same checks written down so the next panel is not a heroics session.

← Previous step: SPI, AOI and X-ray

中文

PCB工艺 / 首件与点亮

组装 · 16

首件与点亮

电源、烧录、第一次串口。这是我们卖的落地步骤——在工厂工艺之后，而不是代替工厂。

01 这一步做什么

  • 确认电源轨、灯、晶振，ESP32 能起来或有启动日志。
  • 烧已知固件，再按设计做 ping、I2C 扫描或连 Wi-Fi。
  • 故障要分开记：板厂、贴片、还是固件。一句「板坏了」会浪费下一版。

02 落到 ESP32 板上

  • ESP32 模组串口脚各不同；3.3 V 之后日志就是第一口活气。
  • 天线净空错了表现为 RSSI 差，AOI 看不到缺电阻。
  • Wi-Fi 发射掉电多半是电源，不是「ESP32 芯片差」。

03 常见失败

  • DCDC 封装镜像，3.3 V 没有，前面工艺看起来都对。
  • 启动脚悬空，进下载模式或电压错。
  • 模组有认证就以为整机有 FCC/CE。产品不是模组。

04 我们查什么

  • 这就是点亮包：电源轨、烧录、第一次串口、第一次总线、一段视频。
  • 可复现路径是把同样检查写下来，下一拼板不再靠运气。

← 上一步: SPI、AOI 与 X-ray